| PART |
Description |
Maker |
| M470T2953BS0-CD5_CC M470T6554BG0-CD5_CC M470T6554B |
40 Characters x 4 Lines, 5x7 Dot Matrix Character and Cursor 200pin缓冲的SODIMM基于512Mb乙芯4位非ECC
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC 200pin缓冲的SODIMM基于512Mb乙芯64位非ECC
64M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
32M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC 200pin缓冲的SODIMM基于512Mb乙芯4位非ECC
128M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200
Triac; Thyristor Type:Snubberless; Peak Repetitive Off-State Voltage, Vdrm:400V; On State RMS Current, IT(rms):6A; Gate Trigger Current (QI), Igt:35mA; Current, It av:6A; Gate Trigger Current Max, Igt:35mA RoHS Compliant: Yes
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronic
|
| 75198-2512 0751982512 |
2.00mm (.079) Pitch 8-Row VHDM? Lite Backplane Header, Guide Pin Signal Module,Pin End Version, 200 Circuits, Pin Length 6.25mm (.246)
|
Molex Electronics Ltd.
|
| M381L6523BUM-LCC M368L2923BTM-CCC M368L2923BTM-LCC |
DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
|
SAMSUNG[Samsung semiconductor]
|
| M374S6553BTS-C7A M366S2953BTS-C7A M366S3354BTS M36 |
SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
|
SAMSUNG[Samsung semiconductor]
|
| M366S3354BTS-C7A M374S6553BTS-C7A M374S2953BTS-C7A |
SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| 0010451111 AE-3003-11AG 10-45-1111 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 11 Circuits, Gold (Au) Plating,Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 11 Circuits, Gold (Au) Plating,Pin Length 19.05mm (.750")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 74062-2503 0740622503 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 74062-2514 0740622514 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| DRAM-DDR-RDIMM |
DDR3 240-Pin Registered-ECC DIMMs
|
List of Unclassifed Man...
|
| HYS72V32220GU-8-C2 HYS64V16300GU HYS64V16300GU-7.5 |
SDRAM Modules - 256MB PC133 (2-2-2) 2-bank End-of-Life
SDRAM Modules - 256MB PC133 (2-2-2) 2-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (2-2-2) 1-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (2-2-2) 1-bank End-of-Life
SDRAM Modules - 256MB PC133 (3-3-3) 2-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (3-3-3) 1-bank (ECC) End-of-Life
SDRAM Modules - 256MB PC133 (3-3-3) 2-bank End-of-Life
SDRAM Modules - 128MB PC133 (3-3-3) 1-bank End-of-Life
3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules
|
INFINEON[Infineon Technologies AG]
|
| 10-08-1061 AE-3003-6A 0010081061 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 6 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 6 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
5.08mm (.200") Pitch KK垄莽 Header, Vertical, Round Pin, 6 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
|
Molex Electronics Ltd.
|
| 74061-2502 0740612502 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246")
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246)
|
Molex Electronics Ltd.
|
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